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据《韩联社》报道称 ,三星电子斥资 170 亿美元在美国德州奥斯汀近郊设立的全新晶圆代工厂预计下月动工。该工厂占地超 500 万平方米 ,计划 2024 年投产 ,主要用于生产 5G 、高性能计算机HPC)和https://img.3dmgame.com/uploads/images/news/20190909/1567999846_280575.png|https://img.3dmgame.com/u...
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